Features
- Can choose different model Flip (SB802F) or Non-Flip (SB802)
- Optional DAF heating module
- Multiple graphics functions
- Customizable functional requirements
Specification
- Wafer size: 8”、12”
- Chip size: 0.5~25mm
- Accuracy: ±25um (X、Y)、±2˚ (θ)
- Strip Size: 300mm (length)＊100mm (width)＊2.5mm (thickness)