Features
- Multi-Bin Pick & Place Operation
- Compatible with two different sizes of Waffle Tray during Pick & Place Operation
- Tray size change time, less than 30mins
- Auto Zoom
Specification
- Wafer size: 8”、12”
- Chip size: length 0.5 ~ 50.0mm, width 0.5 ~ 2.5mm (if the length of the die is 50mm, the width should not be less than 1.0mm)
- Waffle Tray: 2”、3”、4”
- Cycle time: ≤0.6sec
- Maximum number of Sorting Bins: 6(Max.)