Features
- Applicable to a variety of package types
- Lateral CCD dispensing monitoring
- Customized optical communication TO-can die bonding function
- Customizable functional requirements
Specification
- Wafer Ring Size: 6”
- Chip size: 6~40mil
- Accuracy: ±38um (X、Y)、±3˚ (θ)
- Work Table: 230*120mm