DB157 ｜ LED Bonder ｜ LED

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About YTEC
Products
Services
Investors
CSR
News Join Us
Customer Services
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Company Profile
Business Philosophy
Organization
Management Team
Milestone
Policy and Certification
TPEx information platform
Semiconductor
LED
RFID
Mini LED
Semiconductor OEM Service
LED OEM Service
RFID OEM & ODM Service
Investors Financials
Corporate Governance
Shareholders
Sustainable Operation Policy
Corporate Social Responsibility
Stakeholder Communication
Environmental Protection
Happy Workplace
Frequently Asked Questions
Sustainable Supply Chain Management
CSR Report Download
E-Learning
Customer Service
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简体中文
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Multiple applications LED Die Bonder

DB157

Information Request
DB157
DB157

Features

 
  • Applicable Backlight Bonding
  • Lateral CCD dispensing monitoring
  • Customizable functional requirements

Specification

 
  • Wafer Ring Size: 6”
  • Chip size: 6~40mil
  • Accuracy: ±38um (X、Y)、±3˚ (θ)
  • Work Table: 600*120mm


 
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