FR10M | RFID Dry Inlay Bonder | RFID

RFID Dry Inlay Bonder

FR10M

Information Request
FR10M
FR10M

Features

 
  • Real-time monitoring of glue dispensing status, glue amount identification function
  • Glue amount identification function before die bonding
  • Real-time monitoring of die bonding status
  • QC photographing - Manual inspection
  • Glue amount detection after test

Specifications

 
  • UPH : 7500 Pcs
  • Bonding tape calculation: (software) count the length of the tape
  • Bonding precision: ± 33 um
  • Angle precision:± 2 °
  • Number of hot stamping head groups: 32 sets
  • Hot stamping temperature: normal temperature ~200℃± 5℃
  • Can produce products within 40~120mm width
  • Can be dual-path production, testing, dividing and sawing, receiving


 
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