FR30M | RFID Dry Inlay Bonder | RFID

High Efficiency RFID Dry Inlay Bonder

FR30M

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FR30M
FR30M
FR30M
FR30M

Features

 
  • Web outer diameter software calculation
  • Single Jetting valve device and Double Multi-Bonding Arms module
  • Real time jetting monitoring and control function
  • Jetting monitoring function before bonding
  • Real time bonding monitoring
  • Hot stamping module programmable control
  • Auto takes tag backside pictures for QC operator visual inspection
  • Jetting monitoring after testing

Specifications

 
  • UPH of Bonding: 30,000ea/hour
  • Bonding Accuracy: ± 30μm
  • Bonding Theta (Rotation): ± 2°
  • Hot stamping unit: 40 sets
  • Temperature: Ambient to 300°C ± 5°C
  • Web width: 40-340mm (Max.)
  • Capable of multi-rows for production, testing, slitting and winding

FR30M Product Introduction

UPH of Bonding: 30,000ea/hour

 


 

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FR30M brochure
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