KEY FEATURES
- Able to connect to the test system (optional: customized)
- With 6S Fail recycle waffle tray (2”)
| 規格 | |
|---|---|
| Wafer | 8”、12” |
| Chip Size(mm) | 0.5mm＊0.5mm~8mm＊8mm |
| Chip Thickness | 0.1mm~1.5mm |
| Accuracy | XY≦±25μm, θ≦±1° |
| Pick and Place Force | 30g~80g |
| Tape Reel | 7” & 13” Reel |
| 55 Inspection | Resolution 10um(Minimum) |
| Loading/Unloading | Automatic |
| Static Protection | 100mm, ±1000V~±100V＜5sec |
| Compressed Air | 5 kg/cm2 |
| Vacuum | >0.9 kg/cm |
| Power | 220 VAC /Single Phase, 6A(Operation), 8A(Peak), 50/60 Hz |
| Power | 3000W |
| Weight | 1250kg |
| Dimension( W*D*H) | 1800＊2600＊1750(mm) (without tower light) |